PICO-ASL4 Rev.B

Be it for latency-sensitive edge computing, rugged industrial automation, or efficient smart transport solutions, AAEON's new PICO-ASL4 and GENE-ASL6 redefine efficiency across both the 2.5" PICO-ITX and 3.5" SubCompact Board form factors. Utilizing the new Intel Atom® x7000RE Processor Series, both boards achieve high-performance processing with integrated deep learning tools on a low-power platform. Built for even the harshest of environments, the PICO-ASL4 and GENE-ASL6 both boast extreme temperature tolerance while maintaining all of the peripheral support, expansion capabilities, and industrial scalability that AAEON's single-boards are renowned for.

All-in-One Heatsink

The PICO-ASL4 removes the standard heatspreader, instead utilizing a slimline all-in-one heatsink to create a more low-profile board with even broader temperature tolerance.

Time Coordinated Connectivity

An I/O featuring dual LAN and six USB ports accelerates task execution with Intel® TCC and TSN for latency-sensitive workloads like transport and manufacturing.

Flexible, Scalable DDR5

Support for 16GB of DDR5 via SODIMM provides the flexibility to customize based on specific performance or capacity requirements, while facilitating seamless upgrades.

Designed to operate in temperatures ranging from -40°C to 85°C, AAEON's PICO-ASL4 and GENE-ASL6 are built to withstand extreme conditions. Each board's unique thermal design promotes longevity and reliability, ensuring optimal performance and effective heat dissipation. Moreover, the GENE-ASL6 supports a power input range of 9V to 36V, enhancing compatibility with various power sources.